Accuform has released the new versions of simulation applications. Users can download new releases of T-SIM 4.7f and B-SIM 2.57 for their active work on projects.

The T-SIM contains modified temperature matrix that was enlarged to 20x20 cells to define temperatures into sheet. The solver has been improved for speed and stability. The B-SIM has the new fast and effective solver and other useful improvements.

Users can download new applications in the support section at our website.

Accuform has released the new T-SIM as version V4.7e with the modified temperature matrix and improved image distortion. Active users can download the new software package in the support section at our website.

Accuform has completed and released the new T-SIM as version V4.7d with multilanguage user environment. There are two language options, English and French. This release contains 32/64bits installation version for Microsoft Windows XP/Vista/7. Users can download the new software package in the support section at our website.

K2010
Duesseldorf
Germany

Accuform exhibited its simulation software at the booth D95-1, Hall 03.

Accuform has released a new versions of T-SIM and B-SIM with Image Distortion for 64-bits platform of Microsoft Windows XP/Vista/7. Existing registred users can simply download the new installation software package in the support section at our website.

5th European Thermoforming Conference
Auerspergstraße 6
A-5020 Salzburg
Austria

Brasil Plast 2005
Anhembi - SP

Visit our Brasil representative (company Ank Eng, Mr. Kin Ng Pui) at booth E37.

New versions of T-SIM and B-SIM were officially released. Existing registered users can download the new installation package in support section.

K2004
Duesseldorf
Germany

Accuform exhibited its simulation software at the booth of CIFRA, Hall 3, C92-2.

4th European Thermoforming Conference
Viareggio
Italy

Euromold 2003
Messegelände, Exhibition Center
Frankfurt/Main
Germany

SPE Thermoforming Conference
Cincinnati, Ohio
USA

Accuform will be there, exhibiting its latest T-SIM at the booth of our North American representative, the Compuplast company from Canada.

New versions of T-SIM and B-SIM are available for download. Registered users can download the full installation package in the support section.

The TMC project mid-term meeting went on. More specific details about the TMC project can be found here on our website.

The World's Plastics Showcase
McCormick Place, Chicago, Illinois
USA

Compulast, our representative for North America and Canada, exhibited on NPE 2003.

Plast 2003
Milano
Italy

Our representative for Italy (GAMBIT s.r.l.) exhibited there our T-SIM and B-SIM.

Euromold 2002
Frankfurt/Main
Germany

Company CADFEM, representing Accuform's products in Germany, will exhibit our software on Euromold 2002. Visit hall 9.2, stand E38 to meet Mr. Joscha Sehnert, who can answer your questions about T-SIM and B-SIM.

Thermoformen technisher Bauteile
Wuerzburg
Germany

T-SIM Version 4.4 and B-SIM version 2.4 has been just released. Registered users can download the full installation package in the user support section.

20. CAD-FEM Users' Meeting
Friedrichshafen
Germany

CAD-FEM company is Accuform's representative in Germany.

Interplast 2002
NEC, Birmingham
United Kingdom

Accuform exhibited its software at the booth of the Porpoise company.

SPE Thermoforming Conference
Nashville, Tennessee
USA

Anybody involved in thermoforming cannot afford to miss this event. Accuform was there too, exhibiting its latest T-SIM at the booth of the Compuplast company.

TMC project kickoff went on. TMC (Thermoforming Material Characterization) project, founded by EU, is focussed on development of a cheap and reliable method of material testing for thermoforming and blow molding. Several companies, including Accuform, IKP Stuttgart and Jacob Kunststofftechnik, are involved.

T-SIM Version 4.35 and B-SIM version 2.35 has been just released. Registered users can download the full installation package in user support section. Both T-SIM and B-SIM are now capable to run on network. For details about network licenses and their prices, please contact Accuform or your local representative. B-SIM now includes an advanced extrusion control, used in extrusion blow molding simulation. This means that B-SIM is capable to simulate also the extrusion phase of extrusion blow molding process.

European Thermoforming Conference
Zurich
Switzerland

Accuform was there exhibiting T-SIM, software for simulation of thermoforming.

Mr. Bernhard Hegemann from IKP presented a paper Improving our Industry through Technical Developments, dealing with a new testing method enabling easy material quality control at thermoforming companies.

Antec 2002
San Francisco, California
USA

Accuform was there exhibiting T-SIM & B-SIM at the booth of our North American representative, the Compuplast company.



Mr. Bernhard Hegemann from IKP Germany presented a paper Process simulation modeling parameters for plug assisted thermoforming of high density polyethylene.

Accuform celebrates 10 years of its existence for plastic industry.

Our websites www.t-sim.com and www.b-sim.com have new design.

New versions of T-SIM Version 4.31 and B-SIM version 2.31 has been released.

Meeting of representatives
Prague
Czech Republic

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